inventory:7,093
3M
BGA-304
(2)
The BGA-304 (Ball Grid Array with 304 balls) provides a high-density, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal performance and small footprint, this 304-ball configuration is well-suited for space-constrained applications in industries such as telecommunications, automotive, and consumer electronics.
| 部品番号 | 説明 | メーカー | 在庫 | BOM に追加 |
|---|---|---|---|---|
| AD8117ABPZ | High-Speed Video Processing for Complex System | ADI | 7,456 | |
| XRT83VSH314IB | Reliable data transmission solution for industrial applications | Maxlinear | 2,056 |