CSP-BGA-64
(2)
The CSP-BGA-64 (Chip Scale Package - Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 64-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| 部品番号 | 説明 | メーカー | 在庫 | BOM に追加 |
|---|---|---|---|---|
| AD4032-24BBCZ-RL | Ultra-Fast, Ultra-Precise Digital Data Acquisition Solution | Analog Devices Inc. | 7,698 | |
| AD4032-24BBCZ | Precise measurement and monitoring of analog signals with high accuracy | Analog Devices | 6,660 |