BGA-416
(7)
The PBGA-416 (Plastic Ball Grid Array) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. Designed for thermal efficiency and minimal footprint, this 416-ball configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors.
| 部品番号 | 説明 | メーカー | 在庫 | BOM に追加 |
|---|---|---|---|---|
| SPC5674FF3MVR3 | RISC architecture e200 for high performance computing | NXP Semiconductors | 8,115 | |
| MPC5567MVR132 | Automotive-grade NXP microcontroller featuring a 32-bit Power Architecture core | Freescale Semiconductor | 7,701 | |
| SPC5566MVR132 | MCU 32-bit e200z6 RISC | Freescale Semiconductor | 6,861 | |
| 79RC32K438-300BBG | Experience seamless communications with the powerful 79RC32K438-300BBG | Renesas | 3,476 | |
| SAKTC1796256F150EBEKDUMA1 | Compact design packs a punch with Hz clock speed and B memory | Infineon Technologies | 2,672 | |
| TC1796256F150EBEKXUMA1 | High-performance microcontroller unit for diverse application | Infineon Technologies | 7,703 | |
| SAK-TC1796-256F150EXBE | This advanced microcontroller features Hz frequency and pin PBGA-package for efficient design integratio | Infineon Technologies | 6,875 |