IS25LP032D-JNLA3

The IS25LP032D-JNLA3 is a standout 32Mb Serial NOR Flash memory chip designed by ISSI. Its high-performance SPI interface delivers fast read speeds and low power consumption, making it a top choice for automotive, industrial, and consumer electronics applications. With a wide voltage range of 2.7V to 3.6V, it offers system designers the flexibility they need. Additionally, its support for both single and dual output modes enhances its compatibility with different microcontrollers and systems

主な特長

• Industry Standard Serial Interface
• - IS25LP032D: 32Mbit/4Mbyte
• - IS25WP032D: 32Mbit/4Mbyte
• - 256 bytes per Programmable Page
• - Supports standard SPI, Fast, Dual, Dual
• I/O, Quad, Quad I/O, SPI DTR, Dual I/O
• DTR, Quad I/O DTR, and QPI
• - Supports Serial Flash Discoverable
• Parameters (SFDP)
• High Performance Serial Flash (SPI)
• - 50MHz Normal and 133Mhz Fast Read
• - 532 MHz equivalent QPI
• - DTR (Dual Transfer Rate) up to 66MHz
• - Selectable Dummy Cycles
• - Configurable Drive Strength
• - Supports SPI Modes 0 and 3
• - More than 100,000 Erase/Program Cycles
• - More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
• - Chip Erase with Uniform: Sector/Block
• Erase (4/32/64 Kbyte)
• - Program 1 to 256 Bytes per Page
• - Program/Erase Suspend & Resume
• Efficient Read and Program modes
• - Low Instruction Overhead Operations
• - Continuous Read 8/16/32/64-Byte
• Burst Wrap
• - Selectable Burst Length
• - QPI for Reduced Instruction Overhead
• - AutoBoot Operation
• Low Power with Wide Temp. Ranges
• - Single Voltage Supply
• IS25LP: 2.30V to 3.60V
• IS25WP: 1.65V to 1.95V
• - 4 mA Active Read Current (typ.)
• - 10 µA Standby Current (typ.)
• - 1 µA Deep Power Down (typ.)
• - Temp Grades:
• Extended: -40°C to +105°C
• Auto Grade (A3): -40°C to +125°C
• Advanced Security Protection
• - Software and Hardware Write Protection
• - Power Supply Lock Protect
• - 4x256-Byte Dedicated Security Area
• with OTP User-lockable Bits
• - 128 bit Unique ID for Each Device
• (Call Factory)
• Industry Standard Pin-out & Packages(1)
• - B = 8-pin SOIC 208mil
• - N = 8-pin SOIC 150mil
• - T = 8-contact USON 4x3mm
• - E = 8-contact XSON 4x4mm
• - K = 8-contact WSON 6x5mm
• - L = 8-contact WSON 8x6mm(Call Factory)
• - M = 16-pin SOIC 300mil
• - G= 24-ball TFBGA 4x6 ARRAY
• - H = 24-ball TFBGA 5x5 ARRAY
• - KGD (Call Factory)